Features
● Low-level off state leakage current of max.1 μA
● Low driver power requirements (TTL/CMOS Compatible)
● High reliability
● No moving parts
● 1500Vms Input/Output isolation

Features
● Low-level off state leakage current of max.1 μA
● Low driver power requirements (TTL/CMOS Compatible)
● High reliability
● No moving parts
● 1500Vms Input/Output isolation

Features
● SOP package 4 Pin type in miniature design(4.4×4.3×2.1mm /.173×.169×.083inch)
● Low driver power requirements(TTL/CMOS Compatible)
● No moving parts
● High reliability

Features
● SOP package 4 Pin type in miniature design(4.4×4.3×2.1mm /.173×.169×.083inch)
● Low driver power requirements(TTL/CMOS Compatible)
● No moving parts
● High reliability

Features
● Low driver power requirements (TTL/CMOS Compatible)
● No moving parts
● High reliability
● Arc-Free with no snubbing circuits
● 3750Vrms Input/Output isolation

Features
● Low driver power requirements (TTL/CMOS Compatible)
● No moving parts
● High reliability
● Arc-Free with no snubbing circuits
● 3750Vrms Input/Output isolation

Features
● Features
● Low driver power requirements (TTL/CMOS Compatible)
● High reliability
● Arc-Free with no snubbing circuits
● 3750 / 5000 Vrms Input/Output isolation

Features
● Low driver power requirements (TTL/CMOS Compatible)
● No moving parts
● High reliability
● Arc-Free with no snubbing circuits
● 3750Vrms Input/Output isolation

Features
● Low-level off state leakage current of max.1 μA
● Low driver power requirements (TTL/CMOS Compatible)
● High reliability
● No moving parts
● 1500Vms Input/Output isolation

Features
● Low-level off state leakage current of max.1 μA
● Low driver power requirements (TTL/CMOS Compatible)
● High reliability
● No moving parts
● 1500Vms Input/Output isolation

PhotoRelays
Photorelays are the most relable,technicaly advanced logic-to-power interface devices.Their basic function is to take a low current signal from a microprocessor to control the switching of both ACand DC loads,while providing an isolation barier between logic andpower.

Features
● SOP package 4 Pin type in miniature design(4.4×4.3×2.1mm /.173×.169×.083inch)
● Low driver power requirements(TTL/CMOS Compatible)
● No moving parts
● High reliability

Features
● Low driver power requirements (TTL/CMOS Compatible)
● No moving parts
● High reliability
● Arc-Free with no snubbing circuits
● 3750Vrms Input/Output isolation

FEATURES
● Supports 0.3 A,0.6 A,0.9 A and 1.2 AON-state RMS currents.
● Handles both 100 and 200 Vrms loads.
● High dielectric strength:5,000 Vrms

Features
● Low-level off state leakage current of max.1 μA
● Low driver power requirements (TTL/CMOS Compatible)
● High reliability
● No moving parts
● 1500Vms Input/Output isolation

Features
● Low-level off state leakage current of max.1 μA
● Low driver power requirements (TTL/CMOS Compatible)
● High reliability
● No moving parts
● 1500Vms Input/Output isolation

Features
● Low-level off state leakage current of max.1 μA
● Low driver power requirements (TTL/CMOS Compatible)
● High reliability
● No moving parts
● 1500Vms Input/Output isolation

Features
● SOP package 4 Pin type in miniature design(4.4×4.3×2.1mm /.173×.169×.083inch)
● Low driver power requirements(TTL/CMOS Compatible)
● No moving parts
● High reliability

Features
● SOP package 4 Pin type in miniature design(4.4×4.3×2.1mm /.173×.169×.083inch)
● Low driver power requirements(TTL/CMOS Compatible)
● No moving parts
● High reliability

Features
● Low-level off state leakage current of max.1 μA
● Low driver power requirements (TTL/CMOS Compatible)
● High reliability
● No moving parts
● 1500Vms Input/Output isolation